The Failure Analysis Enablement Team is seeking a candidate to assist with generating the software tools needed to support failure analysis of NXP products. This candidate will interact with design engineering to gather data needed and will
JOB DESCRIPTION Interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. The devices analyzed include new designs/products, low yield
Job Description: Coordinate and support Qualification for New Product, New Package, and New Wafer Fabrication Technology. Ensure that new product releases meet manufacturability, reliability, customer and market requirements in collaboration with product management, package innovation, wafer
Product Lifecycle Management Within the Global Operations Engineering Team, we are looking for a Product Lifecycle Management (PLM) to join our team in Kuala Lumpur. You will be part of a team with focus on high-quality
Job Description: Manufacturing supervisors are responsible for the day-to-day running of production processes in all types of manufacturing operations. They make sure that the production line is running smoothly and that staff are meeting their production
Job Description Responsible for Failure Analysis (FA) in support of manufacturing and customer needs. Provide report writing for FA , perform and/or oversee preventive maintenance activities and calibration on equipment in the Failure Analysis Lab. Carry
Manage a group of assemblers working in shift to meet factory goals on Safety/Quality/Delivery and Efficiency in Front End BGA/Pre Assy area. Ensure production schedules and goals are met by coordinating material planning, resources planning and
•Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.•Responsible for quality, yield, cost and process improvement activities.•Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.•Need
Position open for merge role of Business Intelligence (BI) reporting and Developer / BA for in house applications. Dual Responsibilities involve: Role 1 : Responsible for using BI tools to help visualize data, deployment of these
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the equipment & manufacturing team on continue improvement programs
Requirements: 1. Graduate with Bachelor Degree in Mechanical Engineering field. 2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a plus, especially in LQFP/QFP) 3. Proficient in Bahasa Malaysia & English (Both Read/Write)
Drive improvement to meet committed KPI through good collaboration with all stake holder (Hardware, PM, Manufacturing & engineering). Train and supervise team of technicians to improve their skill to be able to support all platform. Drive
The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies. Investigates the feasibility of applying scientific and engineering
Packaging Materials Engineer Kuala Lumpur, Malaysia The future starts here! Ready to join NXP in the Package Innovation department The Package Innovation organization is responsible for the design of new packaging products and the development of new
Job Description 1. Analysis of rejects from vision inspection system. 2. To raise MDR (Material Disposition Review) for non-conformance products and raise (CAB) Change Action Board for new machine or product or material qualification. 3. Perform