Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Key Responsibilities : Regulatory Reporting & Submissions Prepare and submit FDA/CDRH reports for new laser products, product modifications, and manufacturing location changes. Manage and maintain all accession numbers and ensure accurate linkage to product records. Compile, validate,
Expected Travel: None Requisition ID: 14347 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
The Role You will be responsible for Maintain tester functionality and minimize downtime. Perform systematic device verification (DV), tester conversions according to production and planner requirements, support new setups and GRR activities, and ensure proper housekeeping
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Job Description Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to