Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Req ID: 135708 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Electrical & Electronic Engineer to join our dynamic and growing organization that
Req ID: 135299 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Engineer, Digital Design to join our dynamic and growing organization that enable