Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are
Job Details: Job Description: Designs, develops, sustains, tests, validates, and debugs software to enable specific factory, wafer process, packaging features, capabilities, solutions, and/or reference platforms for Intel manufactured products. May work across multiple layers of the
Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes
Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate will focus on
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: The Role and Impact: Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where youll play a pivotal role in shaping
Hiring: External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. Role Overview As an EPI engineer, you will act as both a
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
09 - Senior Lead Engineer, Software Req ID: 127797 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE IC/MGR:
Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.
Company Description Continental develops pioneering technologies and services for sustainable and connected mobility of people and their goods. Founded in 1871, the technology company offers safe, efficient, intelligent and affordable solutions for vehicles, machines, traffic and
Job Details: Job Description: Join Intels cutting-edge efforts as a Module Engineer, where you will drive technological innovation and enablement for both high-volume manufacturing and future technologies. In this pivotal role, you will contribute directly to Intels
Job Details: Job Description: As a Module Engineer, you will play a critical role in driving Intels high-volume manufacturing efforts by owning and optimizing cutting-edge manufacturing equipment and processes. Your work will directly enable the rapid miniaturization
Be part of the solution at Technip Energies and embark on a one-of-a-kind journey. You will be helping to develop cutting-edge solutions to solve real-world energy problems. We are currently seeking Piping Material Engineer/ Senior Piping Material
Purpose The Principal Engineers purpose is to deliver projects that enhance operational efficiency, safety, and sustainability, contributing to the organizations strategic objectives and long-term success. Responsibilities You utilize your technical expertise to develop safe and quality solutions
Company Description Technology is our how. And people are our why. For over two decades, we have been harnessing technology to drive meaningful change. By combining world-class engineering, industry expertise and a people-centric mindset, we consult