The position is located at Bidor Industrial Estate, Bidor, Perak, Please confirm your location availability before applying for this position. Job Description 1. Responsible and ensure full compliance and implementation of the Standard Operating Procedures (SOP)
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
JOB RESPONSIBILITIES: 1) Responsible for Ipoh/Penang plant wide in-house calibration and assist engineer on calibration evaluation. In-additional support vendor onsite calibration campaign. 2) Responsible for calibrating in-house equipment and arrange offsite calibration activity. 3) Responsible for
Expected Travel: None Requisition ID: 14329 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the product
Expected Travel: None Requisition ID: 14390 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Financial Reporting & Closing Lead and oversee the monthly and annual financial closing process, ensuring the accuracy, completeness, and timely issuance of financial statements for the Malaysia entity. Prepare comprehensive management and board reports, including detailed financial