Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor
Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor
Job Details: Job Description: Key Responsibilities Lead and execute layout design of digital. analog and mixed-signal circuit. Collaborate closely with circuit designers to understand requirements, constraints, and performance targets. Plan and manage layout schedules, resources, and deliverables,
Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization, statistical
Job Description Job Summary OSAT Assembly Senior Engineer overseas the backend semiconductor manufacturing processes and activities at the OSATs. Acts as a primary technical Interface between Rensas and OSATs. Key Responsibilities Collaborate with OSATs to ensure good
Job Description Job Summary Involving in new product setup, process optimization, device qualification & prototype sample build. Key Responsibilities Lead & drive NPI activities Responsible for new device process window study Perform risk assessment & identify
As a Senior Failure Analysis Engineer, you will play a key role in identifying and determining the root causes of semiconductor device failures. You will perform comprehensive failure analysis at the wafer, package, and die levels, working
Job Description Job Summary We are looking for a Maintenance Engineer to support and sustain manufacturing equipment operations in semiconductor assembly production. The candidate will be responsible for equipment troubleshooting, uptime improvement and continuous improvement activities for
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis, process
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: As a Module Engineer, you will play a critical role in driving Intels high-volume manufacturing efforts by owning and optimizing cutting-edge manufacturing equipment and processes. Your work will directly enable the rapid miniaturization
Job Description Enable Smart Factory transformation through automation & robotic solutions, digitalization, AI adoption, and advanced manufacturing technologies to improve overall operational efficiency. Key Responsibilities Lead and support the implementation of Smart Factory and Automation project/
Job Description The primary purpose of this role is to spearhead the resolution of complex issues in support of Renesas test manufacturing across various OSAT sites. The incumbent will drive continuous improvement initiatives focused on optimizing
Job Description We are looking for a highly driven Senior Test Equipment Engineer who enjoys solving complex manufacturing challenges and delivering measurable business results. This role is more than equipment maintenance. You will own equipment strategy, reliability,
Job Description Responsible for driving wire bonding equipment performance and reliability to meet production targets. The role focuses on improving Overall Equipment Effectiveness (OEE), and minimizing unplanned downtime (UDT). This includes planning maintenance strategies, leading troubleshooting
Req ID: 136092 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: AST-ENG-DEE Job Level: Level 06 IC/MGR: Individual Contributor
Job Description Drive final-stage product reliability and operational excellence by overseeing the quality of Integrated Circuit (IC) testing processes. In this role, you will govern final test operations, including Automated Test Equipment (ATE) setups. You will
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