Job Summary The Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction,
•Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. •Responsible for quality, yield, cost and process improvement activities. •Responsible for process documentation, process spec, standard work instruction, OCAP,
Test Engineer – NPI Development [Hybrid] Job Summary The Test Engineer supports New Product Introduction (NPI) by developing and deploying test solutions for advanced semiconductor products. This role is ideal for experience engineers who are interested
Country Malaysia City KUALA LUMPUR Area Malaysia Workplace location KUALA LUMPUR-PETRONAS TWIN TWRS(MYS) Employer company TotalEnergies EP Sarawak Inc. Domain Geoscience & Reservoir Type of contract Graduate Program Contract duration2 Years Experience Less than 3 years
Role Summary: To be the technical owner of assigned products to manage cost, quality and related technical aspects. To drive and deliver products cost & quality improvement in timely manner, including integral yield improvement, test time