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About the role This role is responsible for end-to-end ownership of both process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel (R2R) semiconductor assembly line. The engineer plays a critical role
The Equipment Engineer, Die Bond & Wire Bond (JG10), is responsible for sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The role focuses on equipment reliability, uptime, preventive and
