Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Responsible for the complete operational management of assigned subcontractor(s) in the back-end packaging Supply Chain, including supporting the subcontractor selection process, the introduction of new products to the subcontractors, managing change control of bill of materials
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and