Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Primary Duties & Responsibilities This role serves as the core management position for facility engineering at TBU MYS and VN manufacturing sites. The post holder will take full leadership of large-scale facility expansion projects, reliability improvement