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Electrical Packaging Jobs In Malaysia - 89 Job Positions Available

1 – 20 of 89 jobs
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  3 days ago
Power Integrations jobs

Job Description We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing

Power Integrations  27 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  22 days ago
Renesas Electronics jobs

Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,

Renesas Electronics  17 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  16 days ago
Texas Instruments jobs

Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and

Texas Instruments  14 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  11 days ago
Intel jobs

Job Details: Job Description: As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our

Intel  8 days ago
Power Integrations jobs

Job Description Staff Packaging Engineer – Ayutthaya, Thailand We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier

Power Integrations  4 days ago
Intel jobs

Job Details: Job Description: Responsibilities will include but are not limited to be part of PGDM Facilities operations team and will own, sustain, and improve system capacity, operational troubleshooting, system upgrade evaluation and optimization. Furthermore, you

Intel  2 days ago
Renesas Electronics jobs

Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),

Renesas Electronics  2 days ago
Monolithic Power Systems, Inc. jobs

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are

Monolithic Power Systems, Inc.  1 day ago
Renesas Electronics jobs

Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power

Renesas Electronics  1 day ago
Renesas Electronics jobs

Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially

Renesas Electronics  1 day ago
Körber jobs

In compliance to ISO standards 9001:2015, ISO 14001:2015 and ISO 45001:2023 Your role in our team: Optimizing Designs: Leverage your research skills to recommend the best technical solutions (systems, equipment, and technologies) that perfectly align with

Körber  3 days ago
Intel jobs

Job Details: Job Description: Note: This role requires regular onsite presence when managing employees whose responsibilities necessitate onsite work. Managers of onsite essential roles are expected to be onsite to support operational needs. Manages and leads

Intel  29 days ago
Nexperia jobs

About the Role This role acts as the key technical interface between Nexperia and its outsourced semiconductor manufacturing partners (subcontractors/OSATs). The engineer ensures stable, high-quality, and cost-efficient IC assembly operations by driving technical alignment, resolving production

Nexperia  24 days ago
Altera jobs

Job Details: Job Description: We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 10+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across silicon, IC

Altera  24 days ago
Intel jobs

Job Details: Job Description: Position OverviewAs the Yield Defect Metrology Technician, you will be instrumental in supporting defect review activities, including defect classification, validation, and hold lot disposition. You will help maintain quality excellence standards while

Intel  22 days ago
Intel jobs

Job Details: Job Description: Be a part of Intels Advanced Packaging Command Center (APCC), the global command center for advanced packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise

Intel  22 days ago

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