Primary Duties & Responsibilities •Design and develop test software to transceiver modules •Development of test software with full OOP design over an existing system framework •Create test algorithms, instrument drivers, perform testing and documentation of test methodologies
JOB RESPONSIBILITIES: 1) Responsible for Ipoh/Penang plant wide in-house calibration and assist engineer on calibration evaluation. In-additional support vendor onsite calibration campaign. 2) Responsible for calibrating in-house equipment and arrange offsite calibration activity. 3) Responsible for new
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the
Primary owner for test equipment PM/Conversion/next level trouble shooting to ensure test equipment stability and Quality. Your role Key responsibilities in your new role Perform Test equipment PM/Tester Calibration/Conversion independently, Receive escalation from shift technician for
Primary Duties & Responsibilities Understand all machine/process parameter settings and controls. Set-up and optimize machine settings to get best yield. Monitor yield and fix process issues with-in the shift. Monitor SPC charts and perform correction on
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Responsible: Responsible for machine setup, operation, troubleshooting, and recovery of Die Attach and Wire Bond equipment. Responsible for performing routine maintenance, cleaning, and daily machine checks according to the maintenance schedule. Responsible for replacing and
Expected Travel: None Requisition ID: 14390 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Company Description We are committed to our culture that values Customer Focus, Flexibility, Knowledge, Speed and Integrity. Joining our team means you will work in a high performing global company where employees collaborate and strive for