Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process. Candidate
Be part of our team! AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial
Job Details: Job Description: In this position, you will be responsible to improve the process and equipment performance of SDx Module in KMDSDP organization.The Role and Impact:- Drive module and equipment excellence by leading a continuous
Job Details: Job Description: The Role and Impact As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, capability, and stability of high-precision assembly
Job Description This position is expected to provide Test Operations and Engineering support for products post manufacturing release and deliver operational excellence through cost reductions, OEE, yield and cycle time improvements to achieve our test KPI