Req ID: 135711 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Systems Applications SAP Short Name: SSE-ENG-DSA Job Level: Level 11 IC/MGR: Individual Contributor
Req ID: 135708 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Electrical & Electronic Engineer to join our dynamic and growing organization that
Company Overview At Motorola Solutions, we believe that everything starts with our people. We’re a global close-knit community, united by the relentless pursuit to help keep people safer everywhere. We build and connect technologies to help
Vantive is a vital organ therapy company on a mission to extend lives and expand possibilities for patients and care teams everywhere. For 70 years, our team has driven meaningful innovations in kidney care. As we
Overview Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over
About us: Be part of Dyson’s Innovation Journey At Dyson, we challenge convention, break boundaries, and engineer products that redefine industries. Our relentless focus on solving real-world problems drives us to develop cutting-edge technologies that deliver
JLL empowers you to shape a brighter way. Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are
Job Description Job Summary We are looking for a Maintenance Engineer to support and sustain manufacturing equipment operations in semiconductor assembly production. The candidate will be responsible for equipment troubleshooting, uptime improvement and continuous improvement activities
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project Collaborate closely with engineers, gaining
About Ekco Founded in 2016, Ekco has quickly become one of Europe’s fastest-growing cloud solution providers and your trusted security-first Managed Service Provider. IT leaders choose Ekco to drive operational efficiency, scale smarter and stay ahead
About Ekco Founded in 2016, Ekco has quickly become one of Europe’s fastest-growing cloud solution providers and your trusted security-first Managed Service Provider. IT leaders choose Ekco to drive operational efficiency, scale smarter and stay ahead
By living according to a common set of values, we create a culture that unifies, embraces the uniqueness we all bring to the company, and positions Integer for long-term success. At Integer, our values are embedded in
Job Description Job Summary Lead a team of manufacturing operators and line leaders to achieve output, quality and cycle time targets Key Responsibilities Follow 5S, safety regulation and quality standard at all the Time Comply with
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Description Standard order management including expedites/pull ins/cancellation/push outs. Support Customers RMA & other RMA related FA support. Support review of account booking/backlog/billing with Sales. Other ad-hoc support covering free of charge sample tracking for Distis,
Job Description Lead a production team to achieve daily quality, delivery, productivity, and cost targets. You will coordinate with cross-functional teams to ensure smooth manufacturing operations while maintaining a safe, compliant, and high-performing work environment. Key
Job Req ID: 29463 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are