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Ic Jobs In Malaysia - 84 Job Positions Available

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Renesas Electronics jobs

Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power

Renesas Electronics  24 days ago
AT&S jobs

Be part of our team! AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support Offices around the globe, is building its first production site in

AT&S  25 days ago
Microchip Technology Inc. jobs

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of

Microchip Technology Inc.  24 days ago
AT&S jobs

Be part of our team! AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and

AT&S  24 days ago
Celestica jobs

Req ID: 134966 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: MG1-ENG-PRM Job Level: Level 09 IC/MGR: Manager Direct/Indirect Indicator: Indirect

Celestica  23 days ago
Renesas Electronics jobs

Job Description The PQE is responsible for ensuring quality and reliability performance of our products, wherever they are designed, manufactured, and assembled, by performing best in class Product Qualification in accordance with international standards and customer

Renesas Electronics  23 days ago
XPENG jobs

IP Verification Engineer Kuala Lumpur Full-time Production / Manufacturing / Processing Responsibilities Responsibilities1. Participate in the development and verification of core IP modules.2. Plan verification strategies, develop verification plans based on product features, and decompose test

XPENG  22 days ago
XPENG jobs

ASIC Design Engineer Kuala Lumpur Full-time Production / Manufacturing / Processing Responsibilities ResponsibilitiesISP Module RTL DesignDesign and implement RTL for one or more blocks in the ISP pipeline (RAW / RGB / YUV domain, 3A statistics,

XPENG  22 days ago
XPENG jobs

Senior Staff ASIC Design Engineer Kuala Lumpur Full-time Production / Manufacturing / Processing Responsibilities ResponsibilitiesISP Module / Sub-System OwnershipOwn the micro-architecture and RTL of key ISP blocks or sub-systems end-to-end, from spec definition through tape-out and

XPENG  22 days ago
Funding Societies jobs

Funding Societies | Modalku is the largest SME digital finance platform in Southeast Asia. We are licensed and operating in Singapore, Indonesia, Thailand, Malaysia and Vietnam, and backed by Sequoia India (Peak XV), Softbank Vision Fund,

Funding Societies  22 days ago
Altera jobs

Job Details: Job Description: Job Summary Altera is seeking an enthusiastic and motivated Analog Layout Design Engineer Intern to join our dynamic team. This internship offers a unique opportunity to gain hands-on experience in the physical

Altera  19 days ago
Next Ventures jobs

Who We Are NEXT Ventures is where ambition takes shape and momentum becomes movement. As a global platform revolutionising access to performance-based capital, we empower the world’s most driven individuals to rise. Through our flagship brand,

Next Ventures  18 days ago
Texas Instruments jobs

Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and

Texas Instruments  19 days ago
Renesas Electronics jobs

Job Description To ensure the quality, functionality and reliability of a product before it released to the customer by identifying and diagnosing defects and issues Key Responsibilities Setup new product & improve test strategies for existing

Renesas Electronics  17 days ago
Celestica jobs

Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: ENG-ENG-PRM Job Level: Level 07 IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Summary The

Celestica  16 days ago
Celestica jobs

Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: LEN-ENG-PRM Job Level: Level 08 IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Summary The

Celestica  16 days ago
Celestica jobs

Req ID: 137119 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Equipment Engineering Manufacturing SAP Short Name: ENG-ENG-EQM Job Level: Level 07 IC/MGR: Individual Contributor Direct/Indirect Indicator:

Celestica  16 days ago
Coherent Corp. jobs

JOB RESPONSIBILITIES: Provide support to R&D NPI programs in product and process development. To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). Handles new transceiver product transfers from

Coherent Corp.  17 days ago
Nexperia jobs

About the Role This role acts as the key technical interface between Nexperia and its outsourced semiconductor manufacturing partners (subcontractors/OSATs). The engineer ensures stable, high-quality, and cost-efficient IC assembly operations by driving technical alignment, resolving production issues,

Nexperia  12 days ago
Altera jobs

Job Details: Job Description: We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 10+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across silicon, IC package,

Altera  12 days ago

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