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Implementation Conversion Jobs In Negeri Sembilan - 1 Job Positions Available

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SOSM QFN Die Bond and Wire Bond Equipment Engineer

Onsemi ( Seremban NSN )

The Equipment Engineer, Die Bond & Wire Bond (JG10), is responsible for sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The role focuses on equipment reliability, uptime, preventive and

Premium Full-time Automation Semiconductor Continuous Improvement Root Cause Analysis Preventive Maintenance
Onsemi  1 day ago

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