Primary Duties & Responsibilities •Design and develop test software to transceiver modules •Development of test software with full OOP design over an existing system framework •Create test algorithms, instrument drivers, perform testing and documentation of test methodologies
Coherent is a global leader in photonics, developing advanced laser, optical and materials technologies that enable semiconductor manufacturing, AI infrastructure, advanced communications and precision industrial applications worldwide. In Scotland, our teams combine engineering expertise, advanced manufacturing and
JOB RESPONSIBILITIES: 1) Responsible for Ipoh/Penang plant wide in-house calibration and assist engineer on calibration evaluation. In-additional support vendor onsite calibration campaign. 2) Responsible for calibrating in-house equipment and arrange offsite calibration activity. 3) Responsible for new
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the
Primary Duties & Responsibilities Understand all machine/process parameter settings and controls. Set-up and optimize machine settings to get best yield. Monitor yield and fix process issues with-in the shift. Monitor SPC charts and perform correction on
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Responsible: Responsible for machine setup, operation, troubleshooting, and recovery of Die Attach and Wire Bond equipment. Responsible for performing routine maintenance, cleaning, and daily machine checks according to the maintenance schedule. Responsible for replacing and
Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world. A career at Flex offers the opportunity to make a difference and invest in
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS