Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Key Responsibilities Defines, documents and enforces system standards. Document Global Infra Design – a high-level description, with diagrams, of how the Wolfspeed technologies integrate. Designs are prepared as per the Site Classification. Include Site Decision Matrixes,
Expected Travel: None Requisition ID: 13989 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Job Description Job Summary An NPI (New Product Introduction) Planner manages production planning, scheduling, and material readiness for new product launches, bridging the gap between engineering design and full-scale manufacturing. Key duties include generating quarterly/weekly production