OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the
Pen Assembly Process Engineer Description - If you are the Pen Assembly Process Engineer in Malaysia, you will: Applies developed subject matter knowledge to solve common and complex business issues within established guidelines and recommends appropriate alternatives. Works on problems
Job Details: Job Description: We are seeking an experienced and highly driven Technical Program Manager (TPM) to lead New Product Introduction (NPI) and technology transfer activities for the Kulim Assembly and Test Manufacturing site.This role serves as
Job Description Job Summary OSAT Assembly Senior Engineer overseas the backend semiconductor manufacturing processes and activities at the OSATs. Acts as a primary technical Interface between Rensas and OSATs. Key Responsibilities Collaborate with OSATs to ensure good
Job Description Job Summary We are looking for a Maintenance Engineer to support and sustain manufacturing equipment operations in semiconductor assembly production. The candidate will be responsible for equipment troubleshooting, uptime improvement and continuous improvement activities for
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis, process qualification, continuous
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Details: Job Description: Join Intels cutting-edge efforts as a Module Engineer, where you will drive technological innovation and enablement for both high-volume manufacturing and future technologies. In this pivotal role, you will contribute directly to
Job Details: Job Description: As a Module Engineer, you will play a critical role in driving Intels high-volume manufacturing efforts by owning and optimizing cutting-edge manufacturing equipment and processes. Your work will directly enable the rapid
Job Summary: The Engineer, SMT Process is responsible for development, improvement, and validation of existing manufacturing processes, equipment, tooling, and fixtures, addresses daily technical issues and challenges in production and operations, implements and supports/utilizes effective manufacturing methodologies,
Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to
Lead Engineer, Manufacturing Process 1 Req ID: 137585 Hiring Manager: , Tan Su Ying Band: 08 Region: Asia Country: Malaysia State/Province: Kedah City: Kulim Detailed Description: OVERVIEW: Reliable and dedicated person wheres can work independently with the
Fantastic challenges. Amazing opportunities. GKN Aerospace is reimagining air travel: going further, faster and greener! Fuelled by great people whose expertise and creativity sets the standards in our industry, we’re inspired by the opportunities to innovate
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs
About the Role As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in
Req ID: 137781 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: Johor Bahru Summary The Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery
Company Description At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and
Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world. A career at Flex offers the opportunity to make a difference and invest in