Req ID: 137975 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: HRM - Human Resources Career Stream: HBP - HR Business Partner Role: Manager 1 Job Title: HR Business
Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Job Description Job Summary OSAT Assembly Senior Engineer overseas the backend semiconductor manufacturing processes and activities at the OSATs. Acts as a primary technical Interface between Rensas and OSATs. Key Responsibilities Collaborate with OSATs to ensure
Job Description Job Summary Involving in new product setup, process optimization, device qualification & prototype sample build. Key Responsibilities Lead & drive NPI activities Responsible for new device process window study Perform risk assessment & identify
Job Description Gain practical exposure to semiconductor product, Test, AVI T&R and Pack engineering operations. Understand the workflow between product engineering, test engineering, and manufacturing teams and develop supervisory and communication skills through daily interactions Participate
Entity: Technology Job Family Group: Procurement & Supply Chain Management Group Job Description: Role Synopsis This role will involve the development and support of processes and systems for strategic sourcing. The provision of Event Management or
Job Description • Carry out setup, handler conversion, repair, and maintenance for test equipment used by Test Manufacturing. • Support Maintenance Engineers in executing improvement projects to enhance handler and test hardware performance. • Provide feedback
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Job Description Job Summary We are looking for a Maintenance Engineer to support and sustain manufacturing equipment operations in semiconductor assembly production. The candidate will be responsible for equipment troubleshooting, uptime improvement and continuous improvement activities
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis,
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project Collaborate closely with engineers, gaining
Job Details: Job Description: Join Intel as a Product Failure Analysis Engineer, where your expertise will contribute to enhancing the performance, quality, and reliability of industry-leading technologies. In this role, you will drive comprehensive failure analysis
About the job To be the focal point in providing high-quality 24/7 technical support to customers of CDN service, which is a large, distributed SaaS cloud offering in over 300 locations around the world. Job Responsibilities
Job Description Job Summary Lead a team of manufacturing operators and line leaders to achieve output, quality and cycle time targets Key Responsibilities Follow 5S, safety regulation and quality standard at all the Time Comply with
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Details: Job Description: As a Technical Writer for Ethernet products, you will play a vital role in simplifying complex technical concepts and ensuring accurate, clear, and engaging documentation for Intels cutting-edge products. Your ability to