Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
Primary Duties & Responsibilities This role serves as the core management position for facility engineering at TBU MYS and VN manufacturing sites. The post holder will take full leadership of large-scale facility expansion projects, reliability improvement
Expected Travel: None Requisition ID: 14071 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Primary Duties & Responsibilities Establish the process capability and the capacity/productivity model. Able to fully define and characterize the designated process Define the Control Plan and improving critical process capability (as defined in the process control
Job Description POSITION GENERAL SUMMARY Responsible to the overall electrical installation in term of how it being manned handled and controlled. Responsible for the overall electrical installation in term of work and job handling by giving
Primary Duties & Responsibilities Responsible for Update Machine, stations, fixtures, test boards allocation and quantity. Update on inventory maintenance database vs IE data. Support Industrial Engineer/Exec on daily IE related tasks. Weekly Report Update. Layout Coordination