Job Description Gain practical exposure to semiconductor product, Test, AVI T&R and Pack engineering operations. Understand the workflow between product engineering, test engineering, and manufacturing teams and develop supervisory and communication skills through daily interactions Participate in
Job Description We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
JOB RESPONSIBILITIES: •Establish the process capability and the capacity/productivity model. •Able to fully define and characterize the designated process •Define the PCP and improving critical process capability (as defined in the process control plan, product drawings/ specification and BOM) •Fully
Job Summary: onsemi is currently seeking a Section Manager to lead the process engineering team in wafer fabrication processes. This individual will leverage their knowledge, skills, and, most importantly, energy and willingness to learn to take on
Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to
Job Description The Backend Process Quality Engineer oversees the final phases of production, including assembly, packaging, and final testing. This role ensures the manufacturing line operates within specified parameters, minimizes defect rates, and drive continuously improves activities.
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
At Fluor, we are proud to design and build projects and careers. We are committed to fostering a welcoming and collaborative work environment that encourages big-picture thinking, brings out the best in our employees, and helps
Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.
Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis, process qualification, continuous
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project Collaborate closely with engineers, gaining an understanding of
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Details: Job Description: Join Intels cutting-edge efforts as a Module Engineer, where you will drive technological innovation and enablement for both high-volume manufacturing and future technologies. In this pivotal role, you will contribute directly to
Job Details: Job Description: As a Module Engineer, you will play a critical role in driving Intels high-volume manufacturing efforts by owning and optimizing cutting-edge manufacturing equipment and processes. Your work will directly enable the rapid