Package Assembly Jobs In Malaysia - 131 Job Positions Available

1 – 20 of 131 jobs
Power Integrations jobs

Staff Package Engineer Power Integrations is looking for experience talent with highly motivation as the Staff Packaging Engineer, to manage and to drive improvement on assembly and NPI engineering at subcontractor factory. This role will be based on

Power Integrations  28 days ago
Infineon technologies jobs

#WeAreIn for jobs that impact everyones life. What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Staff Engineer Package Technology in our Research & Development team, youll have

Infineon Technologies  21 days ago
Infineon technologies jobs

#WeAreIn for jobs that impact everyones life. What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Staff Engineer Package Technology in our Research & Development team, youll have

Infineon Technologies  20 days ago
NXP Semiconductors jobs

Job Summary The Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost

NXP Semiconductors  15 days ago
NXP Semiconductors jobs

Competitive Analysis Intern – Package Innovation Role Summary Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities. Key Responsibilities Perform structured data mining of competitor

NXP Semiconductors  12 days ago
Micron Technology jobs

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring

Micron Technology  7 days ago
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Infineon technologies jobs

#WeAreIn for jobs that impact everyones life. What if your ideas could change the way the world connects, powers up, or thinks? As a Senior Staff Engineer Package Technology in our Research & Development team, youll have

Infineon Technologies  6 days ago
NXP Semiconductors jobs

Package Roadmap Tool Intern – Package Innovation Role Summary Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms. Key Responsibilities Design and implement a Package Roadmap Tool to track technology evolution, capabilities,

NXP Semiconductors  2 days ago
Renesas Electronics jobs

Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart

Renesas Electronics  2 days ago
Renesas Electronics jobs

Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,

Renesas Electronics  2 days ago
Medtronic jobs

Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put

Medtronic  29 days ago
Renesas Electronics jobs

Job Description Test Strategy & Development Develop cost-effective and high-efficiency test solutions for GaN and Silicon device families. Create, debug, and release test programs on discrete testers and mixed signal ATE platforms. Lead the transition of

Renesas Electronics  29 days ago
Advanced Energy jobs

POSITION SUMMARY: Ensures on-time delivery of products to finished goods as scheduled by AE committed shipment date. Improves AE ability to meet customer delivery requirements by understanding BU capacity, identifying constraints, and actively reducing lead times

Advanced Energy  29 days ago
Flex jobs

Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world. A career at Flex offers the opportunity to make a difference and invest in

Flex  28 days ago
Infineon technologies jobs

#WeAreIn for jobs that impact everyones life. What if your ideas could change the way the world connects, powers up, or thinks? As a Principal Engineer Unit Process Development in our Research & Development team, youll

Infineon Technologies  28 days ago
Infineon technologies jobs

#WeAreIn for jobs that impact everyones life. Build the future nobody’s dreamed of yet.are you ready to rethink the impossible? As a Principal Engineer Unit Process Singulation in our Research & Development team, youll have the

Infineon Technologies  28 days ago
Renesas Electronics jobs

Job Description The Sr Stafff QA is responsible for ensuring quality and reliability performance of our products, wherever they are designed, manufactured, and assembled, by performing best in class Product Qualification in accordance with international standards

Renesas Electronics  28 days ago
Flex jobs

Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world. A career at Flex offers the opportunity to make a difference and invest in

Flex  26 days ago
Power Integrations jobs

Senior Test Engineer As a Senior Test Engineer at Power Integrations Malaysia, you will take ownership of all technical aspects of product testing at our subcontract assembly and test locations. You will be responsible for test programs,

Power Integrations  26 days ago
Power Integrations jobs

Job Description We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols

Power Integrations  26 days ago

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