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Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially
Primary Duties & Responsibilities Investigate, DOE, and experiment on bar fab processes to optimize yield and quality of processes. Manage or knowledge of saw process for scribe/cleave, stacking, wafer saw, and integration of bar fab modules
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