Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are
Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate will focus on
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Job Details: Job Description: As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our products, helping
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
Job Description Staff Packaging Engineer – Ayutthaya, Thailand We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control,
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Job Details: Job Description: Designs, develops, sustains, tests, validates, and debugs software to enable specific factory, wafer process, packaging features, capabilities, solutions, and/or reference platforms for Intel manufactured products. May work across multiple layers of the software
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes
Job Details: Job Description: Sort Test Technology Development (STTD) is a technology development organization delivering world-class test equipment and process capability to support Intel and external customer product roadmap. We are looking for an outstanding candidate to join
Job Details: Job Description: We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 10+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across silicon, IC package,
Job Description RBC Capital Market is seeking a strong Senior Software Developer to join the Cash Analytics – Pricing and Risk technology team, responsible for building and supporting core pricing and risk analytics platforms for cash
Job Description This position is expected to provide Test Operations and Engineering support for products post manufacturing release and deliver operational excellence through cost reductions, OEE, yield and cycle time improvements to achieve our test KPI
Job Details: Job Description: Key Responsibilities Shift Monitoring and Operations - Perform real-time monitoring of defect signals, SPC, and inspection data during shift to ensure timely detection, disposition, and escalation of yield risks Data Analytics and
Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to
Location: Contract Manufacturing Site, Penang. Our Purpose TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to