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Packaging Engineer Jobs In Malaysia - 117 Job Positions Available

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Texas Instruments jobs

Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and

Texas Instruments  22 days ago
Western Digital jobs

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Western Digital  21 days ago
Power Integrations jobs

Job Description Staff Packaging Engineer – Ayutthaya, Thailand We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control,

Power Integrations  12 days ago
Renesas Electronics jobs

Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),

Renesas Electronics  10 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  2 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  2 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  3 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  24 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  19 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  18 days ago
Intel jobs

Job Details: Job Description: As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our products,

Intel  17 days ago
Monolithic Power Systems, Inc. jobs

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are

Monolithic Power Systems, Inc.  10 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  4 days ago
Intel jobs

Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate will

Intel  4 days ago
NXP Semiconductors jobs

Responsibilities: Lead, plan, and execute projects related to process assembly development and validation Design, execute, and analyze process related experiments Use software to analyze data including statistical analysis Solve process issues using creative problem solving techniques

NXP Semiconductors  3 days ago
Körber jobs

In compliance to ISO standards 9001:2015, ISO 14001:2015 and ISO 45001:2023 Your role in our team: Optimizing Designs: Leverage your research skills to recommend the best technical solutions (systems, equipment, and technologies) that perfectly align with

Körber  11 days ago
Renesas Electronics jobs

Job Description This position is expected to provide Test Operations and Engineering support for products post manufacturing release and deliver operational excellence through cost reductions, OEE, yield and cycle time improvements to achieve our test KPI

Renesas Electronics  26 days ago
Intel jobs

Job Details: Job Description: Key Responsibilities Shift Monitoring and Operations - Perform real-time monitoring of defect signals, SPC, and inspection data during shift to ensure timely detection, disposition, and escalation of yield risks Data Analytics and

Intel  26 days ago
Intel jobs

Job Details: Job Description: Intel is seeking a Supply Chain Engineer to support direct materials management in the semiconductor assembly and test environment. This role is responsible for ensuring the technical readiness, quality and qualification of incoming

Intel  24 days ago
Intel jobs

Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to

Intel  23 days ago

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