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Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Work Location: Perai, Penang Key Responsibilities Develop and implement reliability test plans for qualification. Define reliability requirements and acceptance criteria in collaboration with design, quality, and manufacturing teams. Use statistical and reliability modeling tools (e.g., Weibull,
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