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You are a leader and curious about technical solutions? You like to shape technologies addressing future trends in volume production of advanced packaging platforms in the semiconductor industry? You are keen to drive development of next
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
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