POSITION & LOCATION Chief Technician (Mechanical – Boiler) - Stesen Janakuasa Tuanku Muhriz CLOSING DATE 21 September 2026 REQUIREMENT ACADEMIC QUALIFICATIONS & KNOWLEDGE • Malaysian citizenship • Minimum 10 years of working experience with preference at
The Equipment Engineer, Die Bond & Wire Bond (JG10), is responsible for sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The role focuses on equipment reliability, uptime, preventive and
As the dedicated Account Manager for TATA Electronics, you will be responsible for the end-to-end management of Nexperias Front-End (FE) and Back-End (BE) outsourcing partnership. This role serves as the primary interface between Nexperia and TATA,
Key Responsibilities: Equipment Reliability & Troubleshooting Analyze machine breakdowns and equipment failures to minimize downtime and improve operational efficiency. Investigate recurring failures and chronic equipment issues, developing and implementing sustainable corrective actions. Provide technical support to