Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Job Purpose Supervise, coordinate and execute laboratory operational activities by conducting them in a safe and reliable manner in compliance with statutory, regulatory and quality requirements, providing effective laboratory operations and services as well as facilitating
Job Responsible: Responsible for machine setup, operation, troubleshooting, and recovery of Die Attach and Wire Bond equipment. Responsible for performing routine maintenance, cleaning, and daily machine checks according to the maintenance schedule. Responsible for replacing and
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Company Description We are committed to our culture that values Customer Focus, Flexibility, Knowledge, Speed and Integrity. Joining our team means you will work in a high performing global company where employees collaborate and strive for