Company Description Bosch, a leading global supplier of technology and services, has been present in Malaysia since 1923, through its network of partners and distributors. Today, Bosch is present in six locations throughout the country, with
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable,
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.