•Responsible for supporting backend process and improvement on assigned packages •Responsible for quality, yield, cost and process improvement activities. •Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc. •Need to collaborate closely with cross functional team members
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden
Primary Duties & Responsibilities Responsible for monitoring process yield and process correction, shift. Responsible for machine set-up optimization and troubleshooting (process side). Perform defect analysis and root cause analysis. Perform data analysis (trend and distribution) of critical product parameters
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products
Req ID: 134966 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: MG1-ENG-PRM Job Level: Level 09 IC/MGR: Manager Direct/Indirect Indicator: Indirect
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
Primary Duties & Responsibilities JOB RESPONSIBILITIES: To assist the process engineer in achieving test yield target. To maintain and qualify equipment, tools/ fixtures for production used. Perform periodic verification and calibration on equipment/ tools/ fixtures. To provide
Primary Duties & Responsibilities Responsible for sustaining & improving the Die Attach & Wire Bond Process. Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for
Primary Duties & Responsibilities Assist engineering on daily process sustaining, process optimization. Conduct DOE, data collection, SPC buyoff and basic troubleshooting on machines. Daily reject verification on each production line and train DLs for machine and parts handling.
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden
Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Job Description We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield
Job Summary: onsemi is currently seeking an experienced Process Engineer to work on wafer fabrication process This person will utilize her/his knowledge, skills, and most importantly energy and willingness to learn, to take on challenges to support onsemis
Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.
Req ID: 137192 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: SLE-ENG-PRM Job Level: Level 09 IC/MGR: Individual Contributor Direct/Indirect Indicator:
JOB RESPONSIBILITIES: •Establish the process capability and the capacity/productivity model. •Able to fully define and characterize the designated process •Define the PCP and improving critical process capability (as defined in the process control plan, product drawings/ specification and BOM) •Fully
Job Summary: onsemi is currently seeking a Section Manager to lead the process engineering team in wafer fabrication processes. This individual will leverage their knowledge, skills, and, most importantly, energy and willingness to learn to take on