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Statistical Physics Jobs In Malaysia - 30 Job Positions Available

1 – 20 of 30 jobs
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  26 days ago
Renesas Electronics jobs

Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing

Renesas Electronics  25 days ago
GlobalFoundries jobs

Develops and modifies process formulations, methods and controls to meet quality standards Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager: •

GlobalFoundries  25 days ago
Coherent Corp. jobs

JOB RESPONSIBILITIES: • To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). • Handles new transceiver product transfers from NPI to mass volume production lifecycle. • Prepares product

Coherent Corp.  25 days ago
Texas Instruments jobs

Change the world. Love your job. Are you looking to grow your career in manufacturing processing at one of the leading semiconductor companies in the world? Put your knowledge and background to work at Texas Instruments

Texas Instruments  20 days ago
Intel jobs

Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing

Intel  19 days ago
Intel jobs

Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate

Intel  19 days ago
Intel jobs

Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intels

Intel  18 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  12 days ago
Coherent Corp. jobs

PRINCIPAL PRODUCT ENGINEER JOB RESPONSIBILITIES: To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). Handles new transceiver product transfers from NPI to mass volume production lifecycle. Prepares product

Coherent Corp.  12 days ago
Lam Research jobs

The group you’ll be a part of The Manufacturing Engineering team is part of Lam Manufacturing Malaysia Operations, reporting into Global Operations. This function will partner with the other Operations team in Malaysia such as Manufacturing,

Lam Research  10 days ago
Western Digital jobs

Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At our core, Western Digital is a company of

Western Digital  8 days ago
Coherent Corp. jobs

JOB RESPONSIBILITIES: To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). Handles new transceiver product transfers from NPI to mass volume production lifecycle. Prepares product engineering documentation and

Coherent Corp.  5 days ago
NXP Semiconductors jobs

Job Summary We are seeking a highly motivated and skilled Test Product Engineer to join our team at NXP Malaysia. In this role, you will be instrumental in ensuring the quality and reliability of our semiconductor

NXP Semiconductors  4 days ago
Renesas Electronics jobs

Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS

Renesas Electronics  27 days ago
Sandisk jobs

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and

Sandisk  29 days ago
Western Digital jobs

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Western Digital  24 days ago
Western Digital jobs

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Western Digital  24 days ago
Western Digital jobs

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Western Digital  24 days ago
Western Digital jobs

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Western Digital  24 days ago

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