The Equipment Engineer, Die Bond & Wire Bond (JG10), is responsible for sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The role focuses on equipment reliability, uptime, preventive and
The Senior NPI Assembly Engineer is responsible for executing New Product Introduction (NPI) activities related to semiconductor assembly processes from development through high-volume manufacturing. This role serves as the technical owner for assembly process qualification, process
The Staff NPI Assembly Engineer is responsible for leading New Product Introduction (NPI) activities related to semiconductor assembly processes from development through high-volume manufacturing. This role serves as the technical owner for assembly process qualification, process