Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Responsible for the complete operational management of assigned subcontractor(s) in the back-end packaging Supply Chain, including supporting the subcontractor selection process, the introduction of new products to the subcontractors, managing change control of bill of materials
JOB RESPONSIBILITIES: Responsible for equipment maintenance and improvements for die attach bonders, wire bonders, welders, ovens, testers, etc. Responsible to lead a group of technicians. Identify, lead and implement cost reduction activities. Responsible in preparing &
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products
You are a leader and curious about technical solutions? You like to shape technologies addressing future trends in volume production of advanced packaging platforms in the semiconductor industry? You are keen to drive development of next
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products
Job Description Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to