Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the
Primary owner for test equipment PM/Conversion/next level trouble shooting to ensure test equipment stability and Quality. Your role Key responsibilities in your new role Perform Test equipment PM/Tester Calibration/Conversion independently, Receive escalation from shift technician for