Expected Travel: None Requisition ID: 14348 About Teleflex Incorporated As a global provider of medical technologies, Teleflex is driven by our purpose to improve the health and quality of people’s lives. Through our vision to become
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
Primary Duties & Responsibilities To establish the Oven /Chamber capability, Oven Control and Maintenance and maintain Oven /Chamber functionality and software revision. To fully understand the necessary controls, maintenance, precautions, setting up parameters to meet the
Primary owner for test equipment PM/Conversion/next level trouble shooting to ensure test equipment stability and Quality. Your role Key responsibilities in your new role Perform Test equipment PM/Tester Calibration/Conversion independently, Receive escalation from shift technician for