Job Description Job Summary Involving in new product setup, process optimization, device qualification & prototype sample build. Key Responsibilities Lead & drive NPI activities Responsible for new device process window study Perform risk assessment & identify technical
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Req ID: 29463 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Job Details: Job Description: In this position, you will be involving in the training, design and development of next generation SOC/CPU for wide range of Intel products. Your responsibilities will include some of the following but
Job Req ID: 29463 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
About Us At Logicalis Asia Pacific, this is where you belong, grow, and thrive — at one of APACs leading AI-driven technology integrators. As the Architects of Change, we combine global expertise with local insight to
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
About the Role We are seeking an experienced Cybersecurity Manager to lead, govern, and continuously enhance the organizations cybersecurity posture across infrastructure, cloud, applications, endpoints, and digital platforms for a Singapore-based financial institution. This role focuses