Ic Packaging Jobs In Malaysia - 19 Job Positions Available

Job Details: Job Description: The Role & Your Impact Join Altera’s post-silicon validation team in Bayan Lepas, driving the validation of timing and static/dynamic power models for our advanced Multi-Chip Package (MCP) FPGAs. In this role,

Req ID 88990 | Puchong, Malaysia, ZF Automotive Malaysia Sdn Bhd. Job Description About the Team Our Supplier Quality team works closely with suppliers, engineering, purchasing, manufacturing, and quality functions worldwide to ensure robust product quality

Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into

At DuPont, our purpose is to empower the world with essential innovations to thrive. We work on things that matter. Whether it’s providing clean water to more than a billion people on the planet, producing materials

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.

Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into

pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With

Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially

#WeAreIn for jobs that impact everyones life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Package Technology, youll have the opportunity to merge creativity with your technical expertise by shaping the

#WeAreIn for jobs that impact everyones life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Cross Platform Technology Integration, youll have the opportunity to merge creativity with your technical expertise by

At DuPont, our purpose is to empower the world with essential innovations to thrive. We work on things that matter. Whether it’s providing clean water to more than a billion people on the planet, producing materials

Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.