Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
Digital IC Synthesis Implementation Engineer Kuala Lumpur Full-time Production / Manufacturing / Processing Responsibilities Job ResponsibilitiesLogic Synthesis & Optimization1.Conduct complex-level and chip-level logic synthesis utilizing mainstream EDA tools, including Synopsys DC/FC and Cadence Genus. 2.Formulate and implement
Req ID: 138237 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Hardware SAP Short Name: LEN-ENG-DHW Job Level: Level 08 IC/MGR: Individual Contributor Direct/Indirect
09 - Senior Lead Engineer, Software Req ID: 127797 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE
JOB RESPONSIBILITIES: • To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). • Handles new transceiver product transfers from NPI to mass volume production lifecycle. • Prepares product
Job Mission: With the establishment of the Finance Business Service, a regional platform has been created to support finance accounting, reporting, and operational activities. As a Senior Accountant, you will execute end-to-end finance operations across both
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI
Req ID: 138284 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Equipment Engineering Manufacturing SAP Short Name: LEN-ENG-EQM Job Level: Level 08 IC/MGR: Individual Contributor Direct/Indirect Indicator:
Job Description The primary purpose of this role is to spearhead the resolution of complex issues in support of Renesas test manufacturing across various OSAT sites. The incumbent will drive continuous improvement initiatives focused on optimizing
Req ID: 135711 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Systems Applications SAP Short Name: SSE-ENG-DSA Job Level: Level 11 IC/MGR: Individual Contributor
Req ID: 138112 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Hardware SAP Short Name: ENG-ENG-DHW Job Level: Level 07 IC/MGR: Individual Contributor Direct/Indirect
Req ID: 138035 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE Job Level: Level 09 IC/MGR: Individual Contributor
Req ID: 136092 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: AST-ENG-DEE Job Level: Level 06 IC/MGR: Individual Contributor Direct/Indirect
Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor Direct/Indirect
Job Details: Job Description: In this position, you will be involving in the training, design and development of next generation SOC/CPU for wide range of Intel products. Your responsibilities will include some of the following but
Job Description Drive final-stage product reliability and operational excellence by overseeing the quality of Integrated Circuit (IC) testing processes. In this role, you will govern final test operations, including Automated Test Equipment (ATE) setups. You will use
Company Description About Grab and Our Workplace Grab is Southeast Asias leading superapp. From getting your favourite meals delivered to helping you manage your finances and getting around town hassle-free, weve got your back with everything.
Be part of our team! AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and
Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor Direct/Indirect