Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially
Responsible for the complete operational management of assigned subcontractor(s) in the back-end packaging Supply Chain, including supporting the subcontractor selection process, the introduction of new products to the subcontractors, managing change control of bill of materials in
You are a leader and curious about technical solutions? You like to shape technologies addressing future trends in volume production of advanced packaging platforms in the semiconductor industry? You are keen to drive development of next generation power