Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power
Job Description We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our
Job Description Staff Packaging Engineer – Ayutthaya, Thailand We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development
Job Details: Job Description: As a Manufacturing Operations Manager, you will play a vital role in driving Intels manufacturing excellence and contributing to the success of production facilities. You will lead a team of Operators and
Job Details: Job Description: We are seeking an experienced and highly driven Technical Program Manager (TPM) to lead New Product Introduction (NPI) and technology transfer activities for the Kulim Assembly and Test Manufacturing site.This role serves
This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. The role drives development from concept
About the Role This role acts as the key technical interface between Nexperia and its outsourced semiconductor manufacturing partners (subcontractors/OSATs). The engineer ensures stable, high-quality, and cost-efficient IC assembly operations by driving technical alignment, resolving production issues,
About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries
Job Details: Job Description: The Role and Impact: As a Senior Material Program Manager – Direct Material, you will play a pivotal role in translating Intels manufacturing goals, market dynamics, and business requirements into actionable strategies
Job Details: Job Description: Position OverviewAs the Yield Defect Metrology Technician, you will be instrumental in supporting defect review activities, including defect classification, validation, and hold lot disposition. You will help maintain quality excellence standards while
Job Details: Job Description: Be a part of Intels Advanced Packaging Command Center (APCC), the global command center for advanced packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise