Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Responsibilities: Lead, plan, and execute projects related to process assembly development and validation Design, execute, and analyze process related experiments Use software to analyze data including statistical analysis Solve process issues using creative problem solving techniques
Competitive Analysis Intern – Package Innovation Role Summary Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities. Key Responsibilities Perform structured data mining of competitor
Req ID 88990 | Puchong, Malaysia, ZF Automotive Malaysia Sdn Bhd. Job Description About the Team Our Supplier Quality team works closely with suppliers, engineering, purchasing, manufacturing, and quality functions worldwide to ensure robust product quality
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable,
Responsible for supplier technical evaluation, qualification, and development activities. Provide technical expertise during supplier selection. Drive supplier capability improvements. Support quality and reliability initiatives. Work cross-functionally to ensure suppliers meet business and engineering requirements. Qualification Bachelor’s
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Hiring: External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. Role Overview As an EPI engineer, you
Company Description Bosch, a leading global supplier of technology and services, has been present in Malaysia since 1923, through its network of partners and distributors. Today, Bosch is present in six locations throughout the country, with
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart
Job Description Test Strategy & Development Develop cost-effective and high-efficiency test solutions for GaN and Silicon device families. Create, debug, and release test programs on discrete testers and mixed signal ATE platforms. Lead the transition of legacy