Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power
Job Details: Job Description: As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Competitive Analysis Intern – Package Innovation Role Summary Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities. Key Responsibilities Perform structured data mining of competitor
Responsibilities: Lead, plan, and execute projects related to process assembly development and validation Design, execute, and analyze process related experiments Use software to analyze data including statistical analysis Solve process issues using creative problem solving techniques
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Job Details: Job Description: The Role and Impact Intel Foundry Construction and Sourcing Advanced Packaging Test Tester Front Office is seeking a Semiconductor Manufacturing Engineer Contract Employee to support customer execution, supply chain operations, manufacturing planning, and business
Company Description We are SGS – the world’s leading testing, inspection and certification company. We are recognized as the global benchmark for sustainability, quality and integrity. Our 99,600 employees operate a network of 2,600 offices and
Job Details: Job Description: As a Manufacturing Operations Manager, you will play a vital role in driving Intels manufacturing excellence and contributing to the success of production facilities. You will lead a team of Operators and
Job Details: Job Description: We are seeking an experienced and highly driven Technical Program Manager (TPM) to lead New Product Introduction (NPI) and technology transfer activities for the Kulim Assembly and Test Manufacturing site.This role serves
Operation Manager 吉隆坡 全职 芯片板块 职位描述 Job Responsibilities:Vendor & Production Management: Act as the primary interface with external packaging and testing factories (OSATs). Manage production schedules, capacity planning, quality control, and yield improvement to ensure the successful
Job Details: Job Description: The Role and Impact As a Module Engineer, you will play a critical role in driving Intels mission of delivering cutting-edge semiconductor technology to the world. This position offers the opportunity to work
Job Details: Job Description: Foundry Quality Reliability and Labs is building a team and capability from the ground up to tackle the challenges of enabling the Intel Foundry business. This opportunity combines the freedom and excitement