Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge
Company Description We are committed to our culture that values Customer Focus, Flexibility, Knowledge, Speed and Integrity. Joining our team means you will work in a high performing global company where employees collaborate and strive for
Responsible for the complete operational management of assigned subcontractor(s) in the back-end packaging Supply Chain, including supporting the subcontractor selection process, the introduction of new products to the subcontractors, managing change control of bill of materials
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Job Description Highly focused Test Operations Leader with extensive experience managing Engineering teams and subcontractors in Malaysia. Proven ability to merge technical excellence with financial stewardship, consistently implementing continuous improvement initiatives to achieve cost reduction goals. Key