Location:Kuala-Lumpur, Malaysia Job ID: R1012713 Date Posted:2026-07-07 Company Name:Hitachi Rail GTS Malaysia Sdn Bhd Profession (Job Category):Administration & Facilities Job Schedule: Full time Remote:No About Us A career at Hitachi Rail will help create a legacy.
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Mission: With the establishment of the Finance Business Service, a regional platform has been created to support finance accounting, reporting, and operational activities. As a Senior Accountant, you will execute end-to-end finance operations across both
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging
Tätigkeitsbereich:Sonstiges Fachabteilung:Procurement NPM & PM Malaysia & Singapore Gesellschaft:Mercedes-Benz Malaysia Sdn. Bhd. Standort:Mercedes-Benz Malaysia Sdn. Bhd., Kuala Lumpur Startdatum:sofort Veröffentlichungsdatum:06.07.2026 Stellennummer:MER00041B6 Arbeitszeit:Vollzeit Bewerben Aufgaben OBJECTIVE OF JOB Drive and implement commodity strategies across the organization. Lead
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: ENG-ENG-PRM Job Level: Level 07 IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Summary The
This role is part of our Hiring Sprint Event on August 1, designed to connect you directly with hiring teams and streamline your path to joining ExxonMobil. The event will take place at our office in
Rapsodo is a Sports Technology company with offices in the USA, Singapore, Turkey & Japan. We develop sports analytics products that are data-driven, portable and easy-to-use to empower athletes at all skill levels to analyse and
Be part of our team! AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, India, Korea; and Sales Support Offices around the globe, is building its first production site in Southeast
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI
Job Details: Job Description: In this position, you will be involving in the training, design and development of next generation SOC/CPU for wide range of Intel products. Your responsibilities will include some of the following but
Change the world. Love your job. As a sourcing specialist you will protect TI’s supply chain through deep acumen of our current, potential, and future supply base. Responsibilities may include: Developing and implementing appropriate sourcing strategies
About TI Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI