The Role: The embedded software team is responsible to design and implement software that runs on the target MCU inside Dyson product under Scrum Agile Practice. The team delivers software that interprets what are the input signal
Change the world. Love your job. Production Specialists support the manufacturing environment at assembly test site. In assembly/test/probe environments, operates various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead
Job Description Job Summary Involving in new product setup, process optimization, device qualification & prototype sample build. Key Responsibilities Lead & drive NPI activities Responsible for new device process window study Perform risk assessment & identify technical challenges
Job Description Gain practical exposure to semiconductor product, Test, AVI T&R and Pack engineering operations. Understand the workflow between product engineering, test engineering, and manufacturing teams and develop supervisory and communication skills through daily interactions Participate
Job Details: Job Description: The Role and Impact: As a Global Product Support Engineer within SMG Intel Customer Support Division, you will be at the forefront of Intels customer experience, serving as a key point of
Company Overview At Motorola Solutions, we believe that everything starts with our people. We’re a global close-knit community, united by the relentless pursuit to help keep people safer everywhere. We build and connect technologies to help
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Position Overview: Responsible for software and hardware tests within the product qualification area Qualification, validation, and verification of computer on modules and embedded systems Testing of specialized IoT applications, including connectivity, reliability, performance, and system integration Supporting
Company Overview At Motorola Solutions, we believe that everything starts with our people. We’re a global close-knit community, united by the relentless pursuit to help keep people safer everywhere. We build and connect technologies to help
Job Description Main responsibilities Work and lead junior engineer towards projects delivery with other layout and circuit design engineers to resolve any technical issues that will affect layout to ensure high quality. Utilize EDA tools (Cadence
About the job This is a unique opportunity to be part of a team that drives testing of analog signal chain products that market in wide system application ranging from factory industrial solution to automotive and
Req ID: 138035 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE Job Level: Level 09 IC/MGR: Individual
Job Details: Job Description: Join our Silicon Validation team and contribute to the development and enablement of next‑generation FPGA devices. As a new graduate engineer, you will support validation activities focused on FPGA configuration flows, device security features,
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Details: Job Description: In this position, you will be involving in the training, design and development of next generation SOC/CPU for wide range of Intel products and Internet of Things. Your responsibilities will include one
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Req ID: 135708 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Electrical & Electronic Engineer to join our dynamic and growing organization that