Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Req ID: 136247 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: SCM - Supply Chain Management Career Stream: SCM - Supply Chain Management Role: Manager 1 Job Title: Manager,
Job Description Job Description The Senior Product Quality Engineer (Sr. PQE) is responsible for leading Ongoing Reliability Testing (ORT) programs and ensuring long-term quality and reliability performance of our products across design, manufacturing, and field deployment.
onsemi (NASD: ON) is a global semiconductor supplier company, with headquarters in Scottsdale, Arizona. The company is recognized as a Fortune 500 company and included in the Nasdaq-100 Index and the S&P 500 index. Products include
Req ID: 137352 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Quality (QUA) Career Stream: Operations Quality (OPQ) Role: Senior Manager (SMG) Job Title: Senior Manager, Operations Quality Job
Job Description We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process
Job Description Analog Mixed Signal Business Unit (AMS) is looking for a Senior Product Engineer to join our team to drive the product development of state-of-the-art products. This is a unique and exciting opportunity to work
Job Description This position is expected to provide Test Operations and Engineering support for products post manufacturing release and deliver operational excellence through cost reductions, OEE, yield and cycle time improvements to achieve our test KPI
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Work Location: Bukit Minyak, Onsite at Penang contract manufacturing facilities Our Purpose TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce.
Job Req ID: 29368 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Job Req ID: 29369 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Req ID: 137730 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: Johor Bahru Summary As a Quality Engineer (QE) in Capital Equipment, you will oversee low-volume, high-complexity assets where every machine represents a massive,
Req ID: 137664 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: Johor Bahru Summary Incumbents are fully qualified to execute job/role accountabilities working independently on most aspects of the job. Work is performed within
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis,
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project Collaborate closely with engineers, gaining an
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Job Description We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market