Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Make a difference in oncology care—where science meets patient impact At GSK, we are united by a shared ambition: to get ahead of disease together. We are seeking an experienced and strategic Medical Affairs Lead (Oncology)
Job Details: Job Description: Join Intels cutting-edge efforts as a Module Engineer, where you will drive technological innovation and enablement for both high-volume manufacturing and future technologies. In this pivotal role, you will contribute directly to
Req ID: 135708 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Electrical & Electronic Engineer to join our dynamic and growing organization that
Req ID: 135299 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Engineer, Digital Design to join our dynamic and growing organization that enable
Req ID: 138035 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design - Software Engineering SAP Short Name: SLE-ENG-DSE Job Level: Level 09 IC/MGR: Individual
Req ID: 135298 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Engineer, Digital Design to join our dynamic and growing organization that enable
Req ID: 136236 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang Summary We are seeking talented and motivated Senior Lead Mechanical Engineer to join our dynamic and growing organization that enable industry
Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor
At Jabil (NYSE: JBL), we are proud to be a trusted partner for the worlds top brands, offering comprehensive engineering, supply chain, and manufacturing solutions. With 60 years of experience across industries and a vast network
Req ID: 124303 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career Stream: Design Engineering Electrical SAP Short Name: SLE-ENG-DEE Job Level: Level 09 IC/MGR: Individual Contributor
Job Details: Job Description: As an STA design engineer candidate will be responsible for timing closure and signoff of FPGA/SoC and Subsystem timing. Candidate will be involved in static timing analysis, providing/deriving interface timing constraints to partitions and
Job Details: Job Description: Drives the design, development, and application of sound data practices through the advancement of algorithms and statistical techniques including descriptive statistics and inferential methods, multivariate analysis, regression analysis, etc. Conducts statistical analyzes
Job Details: Job Description: Sort Test Technology Development (STTD) is a technology development organization delivering world-class test equipment and process capability to support Intel and external customer product roadmap. We are looking for an outstanding candidate to
Job Details: Job Description: Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate will
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intels
Job Details: Job Description: The Role and Impact As an IP Design Verification Engineer, you will play a critical role in ensuring the functionality, quality, and efficiency of Intels cutting-edge USB IP designs. Working within a
Job Details: Job Description: Develops, applies, and maintains quality management systems (e.g., audits, process control, change control, metrologies), utilizes quality and reliability standards and testing methods for the qualification, management and improvement of suppliers, equipment, materials,