Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Job Description Renesas is seeking for a Data analytics supplier quality engineer for its Outsourced foundry, assembly and test subcontractor management. The Data Analytics SQE hybridizes subcontractor quality assurance with advanced data analytics for data visualization,
Job Description This position is expected to provide Test Operations and Engineering support for products post manufacturing release and deliver operational excellence through cost reductions, OEE, yield and cycle time improvements to achieve our test KPI
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure
Work Location: Bukit Minyak, Onsite at Penang contract manufacturing facilities Our Purpose TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce.
Job Description The Senior Product Quality Engineer (Sr. PQE) is responsible for leading Ongoing Reliability Testing (ORT) programs and ensuring long-term quality and reliability performance of our products across design, manufacturing, and field deployment. This role
Job Req ID: 29368 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Job Req ID: 29369 About Supermicro: Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are
Job Description Analog Mixed Signal Business Unit (AMS) is looking for a Senior Product Engineer to join our team to drive the product development of state-of-the-art products. This is a unique and exciting opportunity to work
Req ID: 137730 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: Johor Bahru Summary As a Quality Engineer (QE) in Capital Equipment, you will oversee low-volume, high-complexity assets where every machine represents a massive,
Req ID: 137664 Remote Position: No Region: Asia Country: Malaysia State/Province: Johor City: Johor Bahru Summary Incumbents are fully qualified to execute job/role accountabilities working independently on most aspects of the job. Work is performed within
Job Description We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC),
Job Description Job Summary We are seeking the Process Engineer is responsible for developing, maintaining, and improving manufacturing processes to achieve optimum quality, productivity, yield, and cost performance. The role involves process troubleshooting, root cause analysis,
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to identify the product issue and propose new improvement project Collaborate closely with engineers, gaining an
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications,
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power
Job Details: Job Description: Join Intels cutting-edge efforts as a Module Engineer, where you will drive technological innovation and enablement for both high-volume manufacturing and future technologies. In this pivotal role, you will contribute directly to
Job Description YOUR ROLE AS A: Data Scientist WHAT YOU’LL CHAMPION: You will Improve models and algorithms to further optimize business outcomes. As a Data Scientist, you will work across the following areas: Exploratory analysis: use
Job Description The primary purpose of this role is to spearhead the resolution of complex issues in support of Renesas test manufacturing across various OSAT sites. The incumbent will drive continuous improvement initiatives focused on optimizing