Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially
Job Description We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages,
Job Description We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart
Job Details: Job Description: The DFT Architect at Altera is a senior technical authority responsible for defining, driving, and governing next‑generation DFT architecture across Altera’s most advanced FPGA, SoC, and multi‑die silicon platforms. This role sits
Job Details: Job Description: Foundry Quality Reliability and Labs is building a team and capability from the ground up to tackle the challenges of enabling the Intel Foundry business. This opportunity combines the freedom and excitement
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
Company Description We are SGS – the world’s leading testing, inspection and certification company. We are recognized as the global benchmark for sustainability, quality and integrity. Our 99,600 employees operate a network of 2,650 offices and
Job Description We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into
Job Details: Job Description: Job Description: We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 8+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across